Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain its shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finished, exhibiting a wide process window with low voiding and a long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15, 35, 50, 250, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20-38µm micron range, and a ROL0 flux classification.
Features
No cleaning requiredThermally stableLow voidingExcelling wetting compatibility on most board finishes
