Toshiba THGAM e-MMC™ NAND Flash Memory implements Bit Column Stacked (BiCS) FLASH™ 3D technology with 64- and 96-layer stacking. These flash memories offer the optimal solution for applications where higher data volumes need to be stored in a cost-efficient way. The THGAM eMMC flash memory is fully compliant with the Multimedia Card Association (MMCA) high-speed memory interface standard. These flash memories conform to the latest JEDEC version 5.0 and 5.1.
Features
4GB to 128GB memory15nm FG / BiCS 3D NAND technologyMulti-Level Cell (MLC) technologyConforms to the latest JEDEC version 5.0 and 5.1Integrated memory management:Error correction codeBad block managementWear-levellingGarbage collection
Applications
IndustrialConsumer electronicsMultimedia
